哪位达人可以提供J-STD-030？谢谢！

J-STD-030GuidelineforSelectionandApplicationofUnderfillMaterialforFlipChipandotherMicropackages [attach]10122[/attach] 只有一份2000年的草案，仅供参考。

谢谢！sunjj

下载2次都没成功,请老大确认一下那里出问题了

[quote][size=2][color=#999999]yeh发表于2013-1-1521:29[/color][url=forum.php?mod=redirect&goto=findpost&pid=119733&ptid=13857][/url][/size] 下载2次都没成功,请老大确认一下那里出问题了[/quote] 你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱里. J-STD-030 December2000 GuidelineforSelectionandApplicationofUnderfillMaterial forFlipChipandotherMicropackagesDraft7 UnderfillAdhesivesfor FlipChipApplicationsTaskGroup(5-24f) 1Scope Thisguidelinecoverspolymerbasedunderfillmaterialsintendedforuseinelectronicpackagingassembly applicationstorelievestressonjointsthatinterconnectflipchips(FC),chipscalepackages(CSP)andballgrid arrays(BGA)toaninterconnectingsubstrate. 1.1Purpose Thepurposeofthisdocumentistoestablishevaluationcriterionformaterial,thatwhenusedincombinationwiththe assemblyandjoiningprocesses,willsubstantiallyincreasethethermalfatiguelifeofI/Oconnections(e.g.,solder bumps,goldbumps,conductiveadhesive,combinations)particularlywhenthereiscoefficientofthermalexpansion (CTE)mismatch,substantiallydifferentexpansionvaluesbetweentheflipchiporotherpackageandtheassembly substrate. 1.2Intent Theintentofthedocumentistohelpinidentifyingunderfillmaterialswhosepropertiesarecompatiblewith componentassemblyjointstoreducethermomechanicalstresssothatperformanceoftheassemblyisenhanced.The additionalroleofunderfillisprotectingthedevicefromenvironmentalfactorsandincreasingstrength.Materials usedinunderfillapplicationsshouldnotadverselyaffectdevicereliability(ionicimpurities,alphaemitters)nor degradeelectricalperformance.Evaluationmethodsareprovidedinthedocumentthatareintendedtobeusedfor assessingunderfillmaterialperformanceinspecificapplications.Methodsarealsoincludedthatwillassistin estimatingprocessingtime. 2Applicabledocuments 2.1IPC IPC-T-50TermsandDefinitionsforInterconnectingandPackagingElectronicCircuits IPC-SM-782SurfaceMountDesignandLandPatternStandard IPC-SM785GuidelinesforAcceleratedReliabilityTestingofSurfaceMountSolderAttachments IPC-SM-840QualificationandPerformanceofPermanentSolderMask IPC-TM-650TestMethodsManual TM2.4.28Adhesion,SolderMask(Non-MeltingMetals) TM2.6.1FungusResistancePrintedWiringMaterials TM2.6.3.3SurfaceInsulationResistance,Fluxes TM2.6.14.1ElectrochemicalMigrationResistanceTest 2.2JointIndustryStandard J-STD-004RequirementsforSolderingFluxes J-STD-012ImplementationOfFlipChipandChipScaleTechnology J-STD-020Moisture/ReflowSensitivityClassificationforNon-HermeticSolidStateSurfaceMountDevices J-STD-026SemiconductorDesignStandardforFlipChipApplications J-STD-028PerformanceStandardforConstructionofFlipChipandChipScaleBumps 2.3AmericanSocietyforTestingandMaterials(ASTM) ASTM-D-150StandardTestMethodsforACLossCharacteristicsandPermittivity(DielectricConstant)ofSolid ElectricalInsulation ASTMD257StandardTestMethodsforDCResistanceorConductanceofInsulatingMaterials

[quote][size=2][color=#999999]admin发表于2013-1-1523:27[/color][url=forum.php?mod=redirect&goto=findpost&pid=119752&ptid=13857][/url][/size] 你的速度有点慢哦。可以正常下载啊。下面是附件部分内容摘录，你再试着下一下。若再不行，明天我发你邮箱...[/quote] 正常下载,谢谢！