ES59008Datarequirementsforsemiconductordie
Part1Generalrequirements
Part2Vocabulary
Part3Mechanical,materialandconnectivityrequirements
Part4Specificrequirementsandrecommendations
–Part4-1Testandquality
–Part4-2Handling,assemblyandstorage
–Part4-3Thermal
–Part4-4Electricalsimulation
Part5Particularrequirementsandrecommendationsfordietypes
–Part5-1Baredie
–Part5-2Barediewithaddedconnectionstructures
–Part5-3Minimally-packageddie
Part6Exchangedataformatsanddata
–Part6-1Dataexchange-DDX
–Part6-2Datadictionary
