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    SONY/Hitachi公司的可靠性资料

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  • Lv.1

    SONY公司的可靠性预计资料(网上可以下载,但比较难找到,发布出来给大家共享,仅为研究之用)

    part1-3在2,3,6楼!下载

    [url=https://www.kekaoxing.com/club/viewthread.php?tid=270&page=9&fromuid=5#pid8360]Hitachi公司可靠性手册,在84-86楼,第9页![/url]

    [[i]本帖最后由cliffcrag于2007-12-2610:39编辑[/i]]

    Lv.1
    SONY公司的可靠性设计手册(PArt1) RAR下载后合并在一起解压缩

    sony.part1.rar
    976.56 KB,下载次数:0[记录]
    暂无描述
    大小:976KB
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    Lv.1
    SONY公司的可靠性设计手册(PArt2) RAR下载后合并在一起解压缩

    sony.part2.rar
    976.56 KB,下载次数:0[记录]
    暂无描述
    大小:976KB
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    Lv.1
    SONY公司的可靠性设计手册(PArt3) RAR下载后合并在一起解压缩(sorry论坛有限制,明天再发)
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    Lv.2
    期等part3先谢谢tomson_y了
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    Lv.1
    附件上传 SONY公司的可靠性设计手册(PArt3) RAR下载后合并在一起解压缩

    sony.part3.rar
    64.83 KB,下载次数:0[记录]
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    大小:64KB
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    Lv.1
    发完了,自己顶一个
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    Lv.6
    可靠性网管理员
    不错,好文章。
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    Lv.2
    终于等到你发part3了。 我把目录列一下。让大家查找方便些。 QualityandReliabilityHandBook Contents CHAPTER1-QUALITYASSURANCEFORSEMICONDUCTORDEVICES 1.1ApproachtowardQualityAssurance..........................................................10 1.2QualityAssuranceSystemforSemiconductorDevices............................16 1.3ProductShippingQualityAssurance..........................................................26 1.4ProductLiability(PL)Act..............................................................................29 CHAPTER2-FAILUREMECHANISMS 2.1FailureModesandMechanisms.................................................................34 2.2FailureMechanismsRootedinDesignandtheWaferProcess................34 2.3FailureMechanismsRootedintheAssemblyProcess..............................52 2.4FailureMechanismsRootedintheMountingProcessandOccurringintheField.....59 CHAPTER3-FAILUREANALYSIS 3.1WhatisFailureAnalysis?.............................................................................98 3.2NecessityofFailureAnalysis.......................................................................99 3.3FailureAnalysis.............................................................................................99 CHAPTER4-RELIABILITYTESTSANDRELIABILITYPREDICTION 4.1ApproachTowardReliability......................................................................120 4.2WhatareReliabilityTests...........................................................................121 4.3AcceleratedLifeTests................................................................................127 4.4ReliabilityEvaluationbyTEG....................................................................130 4.5ReliabilityPrediction...................................................................................136 4.6TestCoverage.............................................................................................151 4.7ReliabilityRelatedStandards.....................................................................152 CHAPTER5-NOTESONTHEUSEOFSEMICONDUCTORDEVICES 5.1EvaluationandAssuranceofSolderingHeatResistance.....................164 5.2NotesonHandlingforElectricBreakdown............................................179 5.3NotesonHandlingforMechanicalBreakdown.....................................191 5.4NotesonHandlingtoPreventThermalBreakdown..............................197 5.5NotesonHandlingtoPreventMisoperation..........................................203 5.6NotesonProductSpecifications,Packing,TransportandStorage......205 Appendix 1LotandProductNameIndications..........................................................218 2SamplingInspections...............................................................................223 3SaturatedVaporPressureTable..............................................................228 4BasicReliabilityTheory............................................................................232
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    Lv.1
    非常感谢!很好的资料!
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    Lv.1
    不错。多谢tomson_y
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