SONY公司的可靠性预计资料(网上可以下载，但比较难找到，发布出来给大家共享，仅为研究之用)
part1-3在2，3，6楼！下载
[url=https://www.kekaoxing.com/club/viewthread.php?tid=270&page=9&fromuid=5#pid8360]Hitachi公司可靠性手册，在84-86楼，第9页！[/url]
[[i]本帖最后由cliffcrag于2007-12-2610:39编辑[/i]]
SONY/Hitachi公司的可靠性资料
tomson_y
Lv.1
SONY公司的可靠性设计手册(PArt1)
RAR下载后合并在一起解压缩
sony.part1.rar
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tomson_y
Lv.1
SONY公司的可靠性设计手册(PArt2)
RAR下载后合并在一起解压缩
sony.part2.rar
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tomson_y
Lv.1
SONY公司的可靠性设计手册(PArt3)
RAR下载后合并在一起解压缩(sorry论坛有限制，明天再发)
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imm
Lv.2
期等part3先谢谢tomson_y了
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tomson_y
Lv.1
附件上传
SONY公司的可靠性设计手册(PArt3)
RAR下载后合并在一起解压缩
sony.part3.rar
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tomson_y
Lv.1
发完了，自己顶一个
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admin
Lv.6
可靠性网管理员
不错，好文章。
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imm
Lv.2
终于等到你发part3了。
我把目录列一下。让大家查找方便些。
QualityandReliabilityHandBook
Contents
CHAPTER1-QUALITYASSURANCEFORSEMICONDUCTORDEVICES
1.1ApproachtowardQualityAssurance..........................................................10
1.2QualityAssuranceSystemforSemiconductorDevices............................16
1.3ProductShippingQualityAssurance..........................................................26
1.4ProductLiability(PL)Act..............................................................................29
CHAPTER2-FAILUREMECHANISMS
2.1FailureModesandMechanisms.................................................................34
2.2FailureMechanismsRootedinDesignandtheWaferProcess................34
2.3FailureMechanismsRootedintheAssemblyProcess..............................52
2.4FailureMechanismsRootedintheMountingProcessandOccurringintheField.....59
CHAPTER3-FAILUREANALYSIS
3.1WhatisFailureAnalysis?.............................................................................98
3.2NecessityofFailureAnalysis.......................................................................99
3.3FailureAnalysis.............................................................................................99
CHAPTER4-RELIABILITYTESTSANDRELIABILITYPREDICTION
4.1ApproachTowardReliability......................................................................120
4.2WhatareReliabilityTests...........................................................................121
4.3AcceleratedLifeTests................................................................................127
4.4ReliabilityEvaluationbyTEG....................................................................130
4.5ReliabilityPrediction...................................................................................136
4.6TestCoverage.............................................................................................151
4.7ReliabilityRelatedStandards.....................................................................152
CHAPTER5-NOTESONTHEUSEOFSEMICONDUCTORDEVICES
5.1EvaluationandAssuranceofSolderingHeatResistance.....................164
5.2NotesonHandlingforElectricBreakdown............................................179
5.3NotesonHandlingforMechanicalBreakdown.....................................191
5.4NotesonHandlingtoPreventThermalBreakdown..............................197
5.5NotesonHandlingtoPreventMisoperation..........................................203
5.6NotesonProductSpecifications,Packing,TransportandStorage......205
Appendix
1LotandProductNameIndications..........................................................218
2SamplingInspections...............................................................................223
3SaturatedVaporPressureTable..............................................................228
4BasicReliabilityTheory............................................................................232
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gene8508
Lv.1
非常感谢！很好的资料！
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loveIT
Lv.1
不错。多谢tomson_y
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