质量和可靠性（IBM）

IBM Reliability Management System
Reliability fails are a combination of three problem types: wear-out mechanisms, which shorten useful life;
systematic defects caused by process variation beyond acceptable limits; and random defects created by
process deficiencies. IBM manages all three problem types by emphasizing reliability in all design procedures.
Early design and qualification activities eliminate wear-out failure mechanisms (such as hot carriers
and electromigration) and establish technology and process limits that minimize design sensitivity to manufacturing
defects. Process control and tooling improvements, combined with efficient burn-in and Maverick
screens, provide continuous defect reduction. Attributes of the IBM reliability management system are summarized
in Table 1.
Table 1. Reliability Management System
Wear-out Mechanisms: Technology “Weak Points”
Strategy: Eliminate from Design
• Technology Design/Change
• Chip Design Ground Rules
• Application Specifications
Systematic Defects: Process Marginality beyond acceptable norm
Strategy: Control Technology Process
• Technology Design
• Layout Ground Rules
• Process Monitors
Random Defects: Process Deficiencies
Strategy: Continual Defect Reduction
• Technology/Tooling Improvements
• Screen Out Residuals
• Wafer/Chip Screens
• Maverick Controls
• High-Efficiency Burn-In